Very high operating temperatures are not uncommon in modern OBCs. Potting compounds, gap fillers and silicone gels from Wevo help sensitive components function reliably over their entire life cycle. The materials can be tailored to specific customer and component requirement profiles on request.
SAFE OPERATION: HEAT DISSIPATION AND ADHESION
To permit fast charging, the thermal conductivity of Wevo’s two-component silicones can be adjusted over a wide range: from 1 W/m·K for potting compounds (e.g. WEVOSIL 22102 FL) to highly thermally conductive gap fillers with 4 W/m·K (e.g. WEVOSIL 26040 FL).
At the same time, due to their pronounced tackiness, Wevo silicone gels for electronic components adhere very well to the housing, even when fully cured – despite the high operating temperatures.
EFFICIENT SERIAL PRODUCTION: OPTIMISED FLOW BEHAVIOUR
The silicone-based potting compounds, gap fillers and gels can additionally be customised with regard to flow behaviour, in order to improve heat removal of inductive components while ensuring an efficient production process. Reliable filling is then guaranteed, even in the smallest gaps.
WEVO SILICONES FOR DC/DC CONVERTERS
The specially optimised WEVOSIL products also pave the way for technological advances in DC/DC converters, which today are increasingly integrated into larger units of the electric drive train such as the HV battery, the main inverter or the OBC.
To provide the best possible solution for modern power electronic components, the Wevo product portfolio also includes polyurethanes and epoxy resins, which Wevo’s developers can likewise adapt to component- and customer-specific requirements on request.
Image source: © WEVO-CHEMIE GmbH
